Case Studies
Case Studies
Clean brush
CoolSculpting procedure
Server chassis
STRUCTURAL/FEA Analysis and Simulation
STRUCTURAL/FEA Analysis and Simulation
Overview of FEA model
Stress result is good
Result: 0.3 mm deflection
strain result for PCB
TOLERANCE Statistical Analysis
THERMAL Analysis, Simulation and Testing
THERMAL Analysis, Simulation and Testing
When designing an LED lighting system, in order to control chip junction temperature better, good thermal design mainly considers two factors: internal packaging and external heat sink structure. It can improve the capability of heat conduction from the chip to the heat sink by optimizing the internal packaging structure of the LED device. Meanwhile, it can improve the capability of heat dissipation from the heat sink to the ambient by optimizing the heat sink structure.
Thermal analysis can satisfy the requirement of daily lighting, the luminous flux of LED lighting system must reach more than 1000 lumen levels at an acceptable cost while maintaining reliability.